- ThicknessAs per customer request
- WidthAs per customer request
- Free margin widthAs per customer request
- Metallization profileAs per customer request
- Inner core diameter75mm
- Bobbins diameterUp to 330mm
Aluminum type metallization is formed by an uniform metal layer well suited for big load tension/current.
Deposition up to 2 Ω/Sq.
Options: width, free margin, technical details. We manufacture aluminum profiles with the latest available technologies and constant control of raw materials composition in order to guarantee layer uniformity.
Typical metallization for DC applications. We achieve resistivity values up to 50 Ω. and resistance profile according to any customer specification. With this resistivity values, the use of humidity protection technology is possible.
Profile Z L G
Classical profiles for PFC applications. We offer the possibility to metallize the desired resistance with different aluminum percentages as selected by the customer.
Metallization profiles composed of a homogeneous aluminum layer and of a partial layer of profiled zinc on top. Zinc can also be deposited on the reinforced border only, in the so-called “Al-reinforced edge” products. The treatment of humidity protection is optional for high resistance aluminum layers. Both the zinc profile, as well as the aluminum layer thickness, are manufactured according to clients’ specifications.
High level supplier and manufacturer of metallized film for standard and special capacitors.
Nucleo Industriale di Bazzano
67100 L’Aquila Italy
Tel. +39 0862 441525
Via Baschenis, 1
20157 Milano Italy
Tel. +39 02 33200909